Aluminum alloy die casting process is adopted to facilitate heat dissipation whenassembling LED lamps and lanternsUsing drive free technology, the chip has low lightattenuation, better heat dissipationeffect, and maintai···
Aluminum alloy die casting process is adopted to facilitate heat dissipation whenassembling LED lamps and lanterns
Using drive free technology, the chip has low lightattenuation, better heat dissipationeffect, and maintains the durability of lamps and lanterns
With high light transmittance PC material, high transmittance and low temperatureare not available, and the irradiation angle range is larger
Fully sealed design, ultra low temperature resistance, no cracking when exposed to
water, electricalinsulation performance, safe use
| photoelectric parameters | ||||
| Model | ROCP651 | ROCP651 | ROCP651 | ROCP651 |
| Power | 100W | 150W | 200W | 250W |
| Lumen | 15000LM | 22500LM | 30000LM | 37500LM |
| Input voltage | AC100-277V | |||
| Light efficiency | 150LM/W | |||
| CCT | 6000K(selectable3000-6500K） | |||
| CRI | Ra≥75 | |||
| PF | ≥0.95 | |||
| Body material | Aluminum shell material | |||
| Working Temp. | ’-25℃~+50℃ | |||
| Life Span | 50000h | |||
| Size and Application | ||||
| Model | ROCP651 | ROCP651 | ROCP651 | ROCP651 |
| Power | 100W | 150W | 200W | 250W |
| Product size(mm) | 150*360*270 | 150*360*270 | 150*425*320 | 150*425*320 |
| Installation method | Brackets | |||
| Application | Indoor places such as workshops, warehouses, factories, exhibition halls, etc | |||
